Stretchable semiconductor packages and semiconductor devices including the same

A semiconductor device comprising:

• a substrate comprised of a flexible and extendible material, wherein the substrate includes conductive patterns disposed therein and the conductive patterns are exposed at a surface of the substrate;
• a semiconductor package including an extendible molding member, a chip embedded in the molding member to have a warped shape, connectors disposed in the molding member, and interconnectors electrically connecting the chip and the connectors, wherein first surfaces of the connectors are exposed at a surface of the molding member and second surfaces of the connectors are coupled to the chip;
• and
• joint electrodes connecting the conductive patterns to the connectors,
• wherein the extendible molding member has flat top surface and flat bottom surface, and
• wherein each of the interconnectors includes:
• a horizontal portion that contacts the second surface of one of the connectors;
• and
• an inclined portion that extends from an end of the horizontal portion to contact one of contact pads of the chip.