Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the same

A method of manufacturing a semiconductor package, the method comprising:

• forming an interconnection structure layer including conductive trace patterns and a dielectric layer on a dummy wafer;
• attaching a carrier wafer to a second surface of the interconnection structure layer opposite to the dummy wafer;
• recessing the dummy wafer to expose a first surface of the interconnection structure layer opposite to the carrier wafer;
• forming first bump pads and elevated pads on the first surface of the interconnection structure layer, the elevated pads being thicker than the first bump pads;
• connecting at least one first semiconductor device to the first bump pads;
• connecting through mold ball connectors to the elevated pads;
• forming a molding layer on the first surface of the interconnection structure layer to expose a portion of each of the through mold ball connectors;
• attaching outer connectors to the exposed portions of the through mold ball connectors, respectively;
• and
• mounting a second semiconductor device on the second surface of the interconnection structure layer.