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US 9,806,011 B2Granted
Non-uniform substrate stackup
AssigneeIntel Corporation
InventorsZhichao Zhang, Tao Wu, Zhiguo Qian, Kemal Aygun
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Abstract
Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement having pads to be coupled to a semiconductor die, with a first trace coupled to a first pad among the pads, and a second trace coupled to a second pad among the pads. The first and second traces may have different thicknesses. Other embodiments including additional apparatuses and methods are described.
Claims11
A method comprising:
- forming a first trace on a first layer of a substrate, the first trace having a first thickness;
- forming a second trace on a second layer of the substrate, the second trace having a second thickness different from the first thickness;
- forming a first pad coupled to the first trace;
- forming a second pad coupled to the second trace;
- forming a third trace on the first layer of a substrate, the third trace having a third thickness different from the first thickness of the first trace;
- forming a fourth trace on the second layer of a substrate, the fourth trace having a fourth thickness different from the second thickness of the second trace, wherein neither the first trace nor the third trace is electrically coupled to the second and fourth traces;
- forming a first dielectric over the first trace and directly contacting the first trace;
- and
- forming a second dielectric over the second trace and directly contacting the second trace.
6 more elements
A method comprising:
- forming a first layer of a substrate, including forming a first trace and a first additional trace of the first layer, the first trace and the additional first trace having different thicknesses, and the additional trace coupled to a pad of the substrate;
- forming a second layer of the substrate, including forming a second trace and a second additional trace of the second layer, the second trace and the additional second trace having different thicknesses, wherein neither the first trace nor the first additional trace is electrically coupled to the second trace and the second additional trace;
- forming a first dielectric over the first trace and directly contacting the first trace;
- forming a second dielectric over the second trace and directly contacting the second trace;
- forming a third layer of the substrate, including forming at least one of a ground plane and a power plane layer of the third layer;
- and
- arranging a die on the substrate, such that the pad is located outside a footprint of the die.
4 more elements
Dependencies are inferred from the claim text.