Package module and method of fabricating the same
AssigneeDelta Electronics (Shanghai) Co., Ltd.
InventorsKai Lu, Zhen-Qing Zhao, Tao Wang
Life of this patent
Estimating the term…
Abstract
A method of fabricating a package module includes placing a pin frame having plural pins on a circuit substrate; bonding the pins to corresponding bonding areas on a circuit substrate, thereby connecting the pins to the bonding areas; cutting off a connecting portion of the pin frame; and bending the pins to be vertical to the circuit substrate. By placing the pins on the corresponding bonding areas on the circuit substrate through the pin frame, and then cutting off the connecting portion of the pin frame and bending the pins, the efficiency of assembling the package module can be greatly promoted.
Claims7
A method of fabricating a package module, the method comprising:
- placing a pin frame having a plurality of pins on a circuit substrate;
- bonding the pins to a plurality of bonding areas on the circuit substrate, thereby connecting the pins to the bonding areas;
- cutting off a connecting portion of the pin frame;
- varying a cross section of a bending portion of each of the pins, wherein the bending portion has at least one recess portion, the recess portion is located at an inner side of the bending portion, and the recess portion is a triangular groove or a zigzag groove, wherein a depth of the recess portion is not greater than one half of a thickness of the bending portion;
- bending the pins to be substantially vertical to the circuit substrate;
- mounting an outer housing to the circuit substrate, wherein the outer housing has a plurality of through holes;
- and
- penetrating the pins through the through holes, wherein a pin body of each of the pins is protruded from the outer housing, and a bending portion of each of the pins is covered by the outer housing.
A package module, comprising:
- a circuit substrate having a plurality of bonding areas;
- an outer housing mounted to the circuit substrate, the outer housing having a plurality of through holes;
- a plurality of pins connected to the bonding areas, wherein each of the pins comprises:
- a soldering portion connected to one of the bonding areas;
- a pin body which is substantially vertical to the circuit substrate and passes through one of the through holes;
- and
- a bending portion connecting the soldering portion to the pin body, wherein the bending portion is covered by the outer housing and has at least one recess portion, the recess portion is located at an inner side of the bending portion, and the recess portion is a triangular groove or a zigzag groove, wherein a depth of the recess portion is not greater than one half of a thickness of the bending portion.
Dependencies are inferred from the claim text.