Semiconductor device manufacturing method
AssigneeRenesas Electronics Corporation
InventorsKatsuhito Kamachi, Hideaki Tamimoto
Life of this patent
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Abstract
A semiconductor device manufacturing method which enhances the reliability of a semiconductor device. The method includes a step in which a source wire is connected with a semiconductor chip while jigs are pressed against a die pad. The jigs each have a first support portion with a first projection and a second support portion with a second projection. Using the jigs thus structured, the first projection is made to contact with a first point on the front surface of the die pad and then the second projection is made to contact with a second point on the front surface of the die pad located closer to a suspension lead than the first point.
Claims20
A method of manufacturing a semiconductor device, comprising the steps of:
- (a) providing a lead frame having a lead, a die pad, and a suspension lead connected to the die pad and bent along a thickness direction of the die pad;
- (b) after the step (a), mounting a semiconductor chip on a first surface of the die pad;
- and
- (c) after the step (b), electrically connecting the semiconductor chip with the lead via a conductive member,
- wherein the step (c) comprises the steps of:
- (c1) providing a stage having a front surface, and a first jig having a first support portion and a second support portion;
- (c2) after the step (c1), arranging the lead frame over the stage such that a second surface of the die pad, opposite to the first surface, faces the front surface of the stage;
- (c3) after the step (c2), pressing the first jig against the first surface of the die pad;
- and
- (c4) after the step (c3), connecting the conductive member with the semiconductor chip, while pressing the first jig against the first surface of the die pad, and
- wherein the step (c3) comprises the steps of:
- (c31) making a first convex part of the first support portion of the first jig contact with a first point on the first surface of the die pad;
- and
- (c32) after the step (c31), making a second convex part of the second support portion of the first jig contact with a second point on the first surface of the die pad located closer to the suspension lead than the first point.
Dependencies are inferred from the claim text.