Chip-scale packaging with protective heat spreader

A chip-scale semiconductor package for placing on a printed circuit board, comprising:

• a semiconductor die having a top surface and an opposing bottom surface;
• packaging at least partially surrounding the semiconductor die and presenting an outer-surface made-ready for contacting the printed circuit board;
• a plurality of conductive leads electrically coupled to the semiconductor die, each of the plurality of conductive leads extending from the bottom surface of the semiconductor die to the outer surface of the packaging to have at least one exposed surface for electrical connection to the printed circuit board;
• and
• a heat spreader assembly configured to cover the top surface, the heat spreader assembly being attached to the die in a first direction perpendicular to the top surface by a layer of adhesive positioned between the heat spreader assembly and the die, a perimeter of the heat spreader assembly extending beyond a perimeter of the packaging, the heat spreader assembly including at least one aperture overlapping with the top surface in the first direction.