Semiconductor device and manufacturing method of semiconductor device
AssigneeToyota Jidosha Kabushiki Kaisha
InventorAkinori Sakakibara
Life of this patent
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Abstract
A bonding member is a member shaped in a sheet and made of electrically-insulating resin. A semiconductor module includes a heatsink and a cooler that are electrically insulated from each other by the bonding member. The bonding member includes a central portion and a peripheral portion. A heat conductivity in a normal direction of the central portion is greater than a heat conductivity in the normal direction of the peripheral portion. Further, a heat conductivity in a surface direction of the peripheral portion is greater than a heat conductivity in the surface direction of the central portion. Further, the heat conductivity in the normal direction of the central portion is greater than the heat conductivity in the surface direction of the central portion.
Claims5
A semiconductor device comprising:
- a semiconductor module;
- a bonding member;
- and
- a cooler,
- wherein the semiconductor module comprises:
- a heatsink;
- a semiconductor element disposed at an inner surface side of the heatsink;
- and
- mold resin sealing the inner surface side of the heatsink and a circumference of the semiconductor element,
- wherein an outer surface of the heatsink is exposed on a surface of the semiconductor module that is bonded to the cooler via the bonding member, and the mold resin surrounds a circumference of the heatsink,
- the bonding member is shaped in a sheet and made of insulating resin, the bonding member comprises a first portion overlapping with the semiconductor element and a second portion overlapping with the mold resin when observed along a normal direction of the heatsink, wherein a heat conductivity in the normal direction of the first portion is greater than a heat conductivity in the normal direction of the second portion, when a direction perpendicular to the normal direction is set as a surface direction, a heat conductivity in the surface direction of the second portion is greater than a heat conductivity in the surface direction of the first portion, and the heat conductivity in the normal direction of the first portion is greater than the heat conductivity in the surface direction of the first portion, and
- the outer surface of the heatsink and the mold resin surrounding the circumference of the heatsink are bonded to the cooler via the bonding member.
Dependencies are inferred from the claim text.