Back to results
US 9,805,998 B2Granted
Liquid sealing material and electronic component using same
AssigneeNamics Corporation
InventorsSeiichi Ishikawa, Haruyuki Yoshii, Kazuyuki Kohara
Life of this patent
Estimating the term…
Abstract
The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.
Claims18
A liquid sealing material comprising:
- (A) a liquid epoxy resin;
- (B) a curing agent selected from the group consisting of an amine curing agent, an acid anhydride curing agent and a phenolic curing agent;
- (C) a silica filler, which is optionally previously surface-treated with a coupling agent;
- and (D) a coupling agent, wherein a content of the silica filler (C) is 40 to 90 wt %,
- wherein the silica filler (C) has an average boron content of 1 to 50 ppm,
- wherein a total content of coupling agent used for surface treatment of the silica filler (C) and the coupling agent (D) is 0.1 to 5.0 wt % in terms of weight percentage with respect to a total weight of the epoxy resin (A) and the curing agent (B), and
- wherein a ratio of the curing agent (B) to the liquid epoxy resin (A) is in a range of 0.5 to 1.6 equivalents per equivalent of epoxy groups.
4 more elements
A liquid sealing material comprising:
- (A) a liquid epoxy resin;
- (B) a curing agent selected from the group consisting of an amine curing agent, an acid anhydride curing agent and a phenolic curing agent;
- and (C) a silica filler,
- wherein the silica filler (C) has an average boron content of 1 to 50 ppm,
- wherein the silica filler (C) is previously surface-treated with a coupling agent,
- wherein an amount of the coupling agent used for surface treatment of the silica filler (C) is 0.1 to 5.0 wt % in terms of weight percentage with respect to a total weight of the epoxy resin (A) and the curing agent (B),
- wherein a content of the silica filler (C) is 40 to 90 wt %, and
- wherein a ratio of the curing agent (B) to the liquid epoxy resin (A) is in a range of 0.5 to 1.6 equivalents per equivalent of epoxy groups.
5 more elements
Dependencies are inferred from the claim text.