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US 9,805,995 B2Granted
Element-accommodating package and mounting structure
AssigneeKYOCERA Corporation
InventorYoshiki Kawazu
Life of this patent
Estimating the term…
Abstract
An element-accommodating package which can improve frequency characteristics of an element-accommodating package having a coaxial connector, and a mounting structure are provided. An element-accommodating package includes a metallic substrate, a frame, a first coaxial connector, a second coaxial connector, and a circuit board. A groove is provided between one side of the frame and a side surface of the circuit board and between a first signal line and a second signal line.
Claims6
A package for accommodating an element, the package comprising:
- a substrate comprising a substrate upper face;
- a mounting region disposed on the substrate upper face;
- a frame disposed on the substrate upper face and comprising:
- an inner wall surrounding the mounting region;
- and
- and outer wall;
- a circuit board comprising:
- a circuit board upper face comprising:
- a first signal line and a second signal line;
- and
- a first conductor layer extending a distance between the first signal line and the second signal line;
- a circuit board lower face comprising a second conductor layer overlapping with the first signal line and the second signal line in a transparent plan view;
- and
- a side, in contact with the inner wall, and having a recess facing the inner wall and disposed between the first signal line and the second signal line;
- a first connector on the inner wall, connected to the first signal line;
- and
- a second connector on the inner wall, connected to the second signal line.
14 more elements
Dependencies are inferred from the claim text.