Semiconductor device
AssigneeRenesas Electronics Corporation
InventorAkihiko Iwaya
Life of this patent
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Abstract
An object of the present invention is to improve the reliability of a semiconductor device. A semiconductor device has a first lead group comprised of a plurality of first leads, a second lead group comprised of a plurality of second leads, and a first suspension lead arranged between the first lead group and the second lead group. Further, the semiconductor device has a first tape attached to each of the first leads, the first suspension lead, and some of the second leads, and a second tape attached to each of the second leads. Further, the first tape has a lead holding part attached to each of the first leads, and a tape supporting part attached to the first suspension lead and some of the second leads and is attached to a position farther from wire connecting portion than the lead holding part.
Claims20
A semiconductor device comprising:
- a sealing body having, in plan view, a first side extended along a first direction and a second side extended along a second direction intersecting with the first direction;
- a first lead group comprised of a plurality of first leads arranged along the first side of the sealing body in plan view;
- a second lead group comprised of a plurality of second leads arranged along the second side of the sealing body in plan view;
- a first suspension lead arranged between the first lead group and the second lead group in plan view;
- a die pad to which the first suspension lead is connected;
- a first tape attached to each of the plurality of first leads, the first suspension lead, and one or more of the plurality of second leads;
- a second tape attached to each of the plurality of second leads;
- a semiconductor chip sealed with the sealing body, and mounted on the die pad;
- a plurality of first wires sealed with the sealing body, and coupling a plurality of first pads of the semiconductor chip and the plurality of first leads, respectively;
- and
- a plurality of second wires sealed with the sealing body, and coupling a plurality of second pads of the semiconductor chip and the plurality of second leads, respectively,
- wherein, in plan view, the first tape has:
- a first part extended along a wire connecting portion of each of the plurality of first leads, and attached to each of the first leads,
- a second part attached to the first suspension lead and one or more of the plurality of second leads, and
- a third part located between the first part and the second part,
- wherein, in plan view, the second part of the first tape extends across the first suspension lead at a first region of the first suspension lead which is spaced, in a direction away from the die pad, from a second region of the first suspension lead defined by virtual extensions of opposite edges of the first part of the first tape, and
- wherein the first tape has no part overlapping with the second tape.
Dependencies are inferred from the claim text.