Method of manufacturing a semiconductor device

A method of manufacturing a semiconductor device, comprising the steps of:

• (a) providing an assembled product, the assembled product including:
• a front surface,
• a rear surface opposite to the front surface,
• a base material including a first surface and a second surface opposite to the first surface, the first surface having a plurality of device areas and a dicing area arranged between the plurality of device areas, the second surface corresponding to the rear surface,
• a plurality of semiconductor chips disposed in the plurality of device areas, respectively, and
• a block sealing member, sealing the plurality of semiconductor chips, including a third surface corresponding to the front surface;
• (b) after the step (a), disposing the assembled product over a dicer cutting stage via a holding jig, the holding jig including a product support portion having a plurality of through-holes and a groove arranged between the plurality of through-holes;
• and
• (c) after the step (b), cutting the base material with a blade along the dicing area of the base material while chucking the block sealing member,
• wherein, in the step (b), the assembled product is disposed over the holding jig such that the front surface of the assembled product faces and contacts the product support portion and is exposed directly to the plurality of through holes and the groove, an arrangement of the groove corresponds to the dicing area, and arrangements of the plurality of through-holes respectively correspond to the plurality of device areas,
• wherein a plurality of ball electrodes is formed over the second surface of the base material, which is opposite to the first surface over which the block sealing member is formed, and
• wherein, after the step (a) and before the step (b), the assembled product is held with a jig transfer hand while the plurality of ball electrodes is contacted with a sponge of the jig transfer hand.