Co or Ni and Cu integration for small and large features in integrated circuits
AssigneeApplied Materials, Inc.
InventorsRoey Shaviv, Ismail T. Emesh
Life of this patent
Estimating the term…
Abstract
In one embodiment of the present disclosure, a method for depositing metal in a feature on a workpiece is provided. The method includes electrochemically depositing a second metal layer on a first metal layer on a workpiece having at least two features of two different sizes in a dielectric layer, wherein the second metal layer is a copper layer and wherein the first metal layer includes a metal selected from the group consisting of cobalt and nickel, wherein the first metal layer completely fills the smallest feature but does not completely fill the largest feature.
Claims21
A method for depositing metal in a feature on a workpiece, the method comprising:
- electrochemically depositing a second metal layer on a first metal layer on the workpiece having at least two features of two different sizes in a dielectric layer, wherein the second metal layer is a copper layer and wherein the first metal layer includes a metal selected from one of a group consisting of cobalt and nickel, wherein the first metal layer completely fills a smallest feature of the at least two features but does not completely fill a largest feature of the at least two features.
Dependencies are inferred from the claim text.