Skip via structures
AssigneeGlobalfoundries Inc.
InventorsXunyuan Zhang, Sean Xuan Lin, James Jay McMahon, Shao Beng Law
Life of this patent
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Abstract
The present disclosure relates to semiconductor structures and, more particularly, to skip via structures and methods of manufacture. The structure includes: a first wiring layer with one or more wiring structures; an upper wiring layer with one or more wiring structures, located above the first wiring layer; a blocking material which contacts at least one of the wiring structures of the upper wiring layer; a skip via with metallization, the skip via passes through the upper wiring layer and makes contact with the one or more wiring structures of the first wiring layer; and a conductive material in the skip via above the metallization and in a via interconnect above the blocking material.
Claims20
A structure, comprising:
- a first wiring layer with one or more wiring structures;
- an upper wiring layer with one or more wiring structures, located above the first wiring layer;
- a blocking material which contacts at least one of the wiring structures of the upper wiring layer;
- a skip via with metallization, the skip via passes through the upper wiring layer and makes contact with the one or more wiring structures of the first wiring layer;
- and
- a conductive material in the skip via above the metallization and in a via interconnect above the blocking material.
A method, comprising:
- forming a via to expose one or more wiring structures of an upper wiring layer;
- forming a skip via which passes through the upper wiring layer and which exposes one or more wiring structures of a lower wiring layer;
- forming a blocking material in the via which covers the exposed one or more wiring structures of the upper wiring layer;
- selectively growing metal material in the skip via;
- and
- filling remaining portions of the skip via and the via with conductive material.
A method, comprising:
- forming a wiring layer with one or more wiring structures in a lower wiring layer;
- forming a wiring layer with one or more wiring structures in an upper wiring layer, located above the lower wiring layer;
- forming a first via to expose the one or more wiring structures of the upper wiring layer and a second via which passes through the upper wiring layer and which ends above the lower wiring layer;
- forming a blocking material in the first via to block the exposed one or more wiring structures of the upper wiring layer;
- extending the second via landing on the lower wiring layer to form a skip via exposing the one or more wiring structures of the lower wiring layer, while the blocking material protects the exposed one or more wiring structures of the upper wiring layer;
- filling at least the skip via with conductive material to contact the one or more wiring structures of the lower wiring layer and in electrical connection with the one or more wiring structures of the upper wiring layer;
- and
- filling remaining portions of the skip via and the first via with a different conductive material.
Dependencies are inferred from the claim text.