Lead frame and a method of fabrication thereof

A method of manufacturing a lead frame, the method comprising the steps of:

• providing an electrically-conductive base material having first and second planar sides;
• partially etching the first planar side of the base material to form partially etched portions and forming holes through the electrically-conductive base material, which are outside of the partially etched portions, simultaneously with the partially etched portions;
• forming a plurality of conductive contact points onto portions of the surface of the first planar side of the base material, wherein:
• the step of forming the plurality of conductive contact points comprises forming a conductive layer, which is separate from the base material, onto the surface of the first planar side of the base material;
• and
• the partially etched portions are located in between the plurality of conductive contact points;
• providing a non-conductive filling material over a flat planar surface of the first planar side of the base material so that the filling material fills the partially etched portions and spaces in between the plurality of conductive contact points to form a continuous layer comprising the filling material and the plurality of conductive contact points such that a thickness of the filling material is equal to a thickness of the conductive layer wherein the plurality of contact points are exposed;
• and
• etching the second planar side of the base material to expose a pattern of the filling material in the partially etched portions from the second planar side of the base material and to thereby form a plurality of isolated conductive regions on the second planar side of the base material, each isolated conductive region being connected with at least a respective one of the plurality of contact points on the surface of the first planar side of the base material,
• wherein the steps included in the method are performed without a die being attached to the base material;
• and
• a single partially etched portion is located between adjacent conductive contact points of the plurality of conductive contact points.