Substrate separation apparatus for stacked body

A substrate separation apparatus configured to separate a second substrate bonded to a first substrate, comprising:

• a fixing jig capable of fixing the first substrate;
• a first suction unit over the fixing jig comprising:
• first suction portions each comprising:
• first suction pads capable of being attached to a top surface of the second substrate over the first substrate by suction;
• and
• a second suction unit over the fixing jig comprising:
• a second suction portion comprising:
• a second suction pad capable of being attached to the top surface of the second substrate by suction,
• wherein the first suction portions are provided along an outer periphery of the second substrate,
• wherein the second suction portion is provided near the outer periphery of the second substrate, and
• wherein the substrate separation apparatus is configured so that a suction power of the second suction pad is higher than a total suction power of all of the first suction pads of each of the first suction portions.

A method for separating a second substrate from a first substrate, comprising steps of:

• attaching first suction pads of each of first suction portions of a first suction unit to a top surface of the second substrate by suction;
• attaching a second suction pad of a second suction portion of a second suction unit to the top surface of the second substrate by suction;
• moving the second suction pad to separate the second substrate from the first substrate;
• and
• after the moving, moving the first suction pads to separate the second substrate from the first substrate,
• wherein a suction power of the second suction pad is higher than a total suction power of all of the first suction pads of each of the first suction portions.