Plasma processing apparatus
AssigneeHitachi High-Technologies Corporation
InventorsMasaharu Gushiken, Megumu Saitou, Ryoji Nishio
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AssigneeHitachi High-Technologies Corporation
InventorsMasaharu Gushiken, Megumu Saitou, Ryoji Nishio
Estimating the term…
In the present invention, there is provided a plasma processing apparatus including a vacuum processing chamber for applying a plasma processing to a sample, a sample stage deployed inside the vacuum processing chamber for mounting the sample thereon, induction antennas provided outside the vacuum processing chamber, a radio-frequency power supply for supplying a radio-frequency power to the induction antennas, and a Faraday shield which is capacitively coupled with the plasma, a radio-frequency voltage being applied to the Faraday shield from the radio-frequency power supply via a matching box, wherein the matching box includes a series LC circuit including a variable capacitor and an inductor, a motor control unit for controlling a motor for the variable capacitor, and a radio-frequency voltage detection unit for detecting the radio-frequency voltage applied to the Faraday shield, the matching box executing a feedback control over the radio-frequency voltage applied to the Faraday shield.
A plasma processing apparatus, comprising:
A plasma processing apparatus, comprising:
A plasma processing apparatus, comprising:
A plasma processing apparatus, comprising:
Dependencies are inferred from the claim text.