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US 9,805,872 B2Granted
Multiple MLCC modules
AssigneeKemet Electronics Corporation
InventorsGalen W. Miller, John E. McConnell, John Bultitude, Garry L. Renner
Life of this patent
Estimating the term…
Abstract
An improved module is provided. The module comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first lead is connected to the first longitudinal edge by a first interconnect and a second lead is connected to the second longitudinal edge by a second interconnect.
Claims38
A module comprising:
- a multiplicity of electronic components wherein each electronic component of said electronic components comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge;
- a first lead connected to each said first longitudinal edge by a first interconnect;
- a second lead connected to said second longitudinal edge by a second interconnect.
A method for forming a module comprising:
- providing a multiplicity of electronic components wherein each electronic component of said electronic components comprises a first external termination with at least one first longitudinal edge and a second external termination with at least on second longitudinal edge;
- placing a first lead into contact with each said first longitudinal edge with a first interconnect between said first lead and said first longitudinal edge;
- placing a second lead into contact with said second longitudinal edge with a second interconnect between said second lead and said second longitudinal edge;
- and
- heating to form a bond of said first interconnect and said second interconnect.
2 more elements
Dependencies are inferred from the claim text.