Acoustically quiet capacitors

A capacitor assembly comprising:

• a capacitor including a first electrode region and a second electrode region, wherein each of the first electrode region and the second electrode region is connected to one of multiple pad bond areas that are located at piezo-electric nodes of the capacitor, each of the multiple pad bond areas is separated from each other pad bond area:
• and
• multiple conductive features, each electrically and mechanically coupled to one of the multiple pad bond areas at the piezo-electric nodes, wherein at least one of the multiple conductive features comprises (i) a core portion, (ii) an outer layer including a first conductive material having a first melting temperature, and (iii) an inner layer between the core portion and the outer layer, the inner layer including a second conductive material having a second melting temperature that is greater than the first melting temperature.

A method for coupling a capacitor to a printed circuit board (PCB), the method comprising:

• aligning a land pattern in the PCB with a plurality of conductive features located at piezo electric nodes of the capacitor, each conductive feature being coupled to the capacitor via one of multiple bond pads, each of the multiple bond pads is separated from each other bond pads:
• applying a solder mask to a region of the PCB surrounding the land pattern;
• and soldering the plurality of conductive features to the land pattern on the PCB by applying a heat to raise a temperature of one of the plurality of conductive features to a first melting temperature that is between a low melting temperature of a first conductive material in an outer layer of the one of the plurality of conductive features, and a high melting temperature of a second conductive material in an inner layer of the one of the plurality of conductive features.