Semiconductor device having interconnection in package and method for manufacturing the same

A semiconductor device comprising:

• a first die connected to a first channel, the first die comprising a first memory chip;
• and
• a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die,
• wherein the first and second dies are disposed in one package;
• wherein the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip;
• wherein the first and second dies are positioned to have side edges that are aligned with each other;
• wherein the first and second dies are disposed in the package and are arranged in a rotated die configuration;
• and
• wherein the first die includes a first swapping circuit configured to change a signal order of signals received at die pads of the first die in response to a swapping enable signal.

A semiconductor device, comprising:

• a package substrate;
• a first semiconductor memory chip on the substrate;
• a second semiconductor memory chip on the substrate and horizontally separated from the first semiconductor memory chip so that a space is formed between a first edge of the first semiconductor memory chip and a first edge of the second semiconductor chip;
• a first set of pads on the first semiconductor chip connected to a first channel dedicated to the first semiconductor chip;
• a second set of pads on the second semiconductor chip connected to a second channel dedicated to the second semiconductor chip;
• a third set of pads on the first semiconductor chip connected to an interconnection circuit on the package substrate;
• and
• a fourth set of pads on the second semiconductor chip connected to the interconnection circuit,
• wherein the interconnection circuit transfers certain signals received from and processed at the first semiconductor chip to the second semiconductor chip, such that the second semiconductor chip receives the processed signals from the first semiconductor chip.