Fingerprint sensing device with interposer structure

A method for manufacturing a fingerprint sensing device, said method comprising:

• providing a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device, wherein a surface of said sensing elements define a sensing plane;
• forming an interposer layer on said sensing chip;
• forming a plurality of interposer structures from said interposer layer, wherein said plurality of interposer structures have the same height above said sensing plane, and wherein said plurality of interposer structures are arranged in alignment with boundaries between said sensing elements, such that a central portion of each sensing element is not covered by an interposer structure;
• providing a liquid adhesive on said sensing chip;
• and
• arranging a protective plate on said sensing chip such that said adhesive is filling out spaces between said plurality of interposer structures, and such that said protective plate rests on said interposer structures, wherein said plurality of interposer structures are formed in a material having a dielectric constant lower than a dielectric constant of said adhesive.