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US 9,804,644 B2Granted
Thermally conductive and vibration damping electronic device enclosure and mounting
OwnerDavid Lane Smithinventor
Life of this patent
Estimating the term…
Abstract
A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of thermally conductive plastic that combine to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.
Claims16
A system for heat dissipation and vibration damping, said system comprising:
- at least one hard disk drive;
- a supporting structure arranged to support said at least one hard disk drive;
- a thermally conductive and vibration damping plastic structure in thermal and mechanical communication with a portion of said at least one hard disk drive and a portion of said supporting structure;
- said thermally conductive and vibration damping plastic structure comprised of one or more materials, each said material comprising the property of being both thermally conductive and vibration damping;
- said thermally conductive and vibration damping plastic structure for damping vibrations that act in at least one plane that is substantially parallel to the top and bottom of said at least one hard disk drive;
- said thermally conductive and vibration damping plastic structure interposed between said at least one hard disk drive and said supporting structure;
- and
- said thermally conductive and vibration damping plastic structure configured to conduct heat away from said at least one hard disk drive.
5 more elements
A method for heat dissipation and vibration damping, said method comprising:
- providing at least one hard disk drive;
- providing a supporting structure arranged to support said provided at least one hard disk drive;
- providing a thermally conductive and vibration damping plastic structure and placing said provided thermally conductive and vibration damping plastic structure in thermal and mechanical communication with a portion of said provided at least one hard disk drive and a portion of said provided supporting structure;
- comprising said thermally conductive and vibration damping plastic structure of one or more materials, each said material comprising the property of being both thermally conductive and vibration damping;
- configuring said thermally conductive and vibration damping plastic structure to dampen vibrations that act in at least one plane that is substantially parallel to the top and bottom of said at least one hard disk drive;
- interposing said provided thermally conductive and vibration damping plastic structure between said provided at least one hard disk drive and said provided supporting structure;
- and
- providing said provided thermally conductive and vibration damping plastic structure configured to conduct heat away from said provided at least one hard disk drive.
5 more elements
Dependencies are inferred from the claim text.