Method of manufacturing array substrate and array substrate

A method of manufacturing an array substrate, wherein the method comprises:

• forming a first functional layer comprising a plurality of array substrate areas and connection areas between adjacent array substrate areas;
• forming a plurality of conductive portions within each of the array substrate areas, the plurality of conductive portions extending from a corresponding one of the array substrate areas to a corresponding one of the connection areas and terminals of the plurality of conductive portions being in connection with capacitor lines within the corresponding one of the connection areas such that two capacitor lines between two adjacent array substrate areas face each other and are formed into a first capacitor element;
• forming a plurality of second functional layers on the first functional layer formed thereon with the plurality of conductive portions and the capacitor lines, for forming a plurality of array substrates;
• performing a cutting process at the connection areas between adjacent array substrates and removing the capacitor lines between the adjacent array substrates;
• wherein, the plurality of conductive portions within each of the array substrate areas comprises:
• a plurality of first conductive portions electrically connected to a capacitor line of the first capacitor element corresponding to an array substrate area;
• and
• a plurality of second conductive portions electrically connected to a capacitor line of another first capacitor element corresponding to an array substrate area;
• wherein, forming a plurality of conductive portions within each of the array substrate areas further comprises forming connection lines that are in electrical connection to the first conductive portions or the second conductive portions, wherein the connection lines of two adjacent array substrate areas are coupled to each other via second capacitor elements;
• and
• wherein, the connection lines, the second capacitor elements, the capacitor lines, the first conductive portions and the second conductive portions are formed from the same material through a single patterning process.