Wafer-level hybrid compound lens and method for fabricating same

#Wafer-level manufacture of camera modules manufactured with complementary metal-oxide semiconductor (CMOS) technologies has contributed to the incorporation of camera modules in high-volume consumer products such as mobile devices and motor vehicles.

#FIG. 1 shows a wafer-level lens 100 incorporated into a camera module 192 of a mobile device 190. FIG. 2 is a cross-sectional view of a prior-art lens 200 that is an example of wafer-level lens 100. Prior art lens includes two planar substrates 211, 212, and resin lenses 221-224. A spacer 231 separates planar substrates 211 and 212. Lens 200 has a height 202. Planar substrate 212 is on a spacer 232 such that lens 200 may be positioned above an image sensor, not shown, of camera module 192.

#Lens 200 has several disadvantages. Shapes of resin lenses 221-224 have limited accessible thicknesses and curvatures because larger thicknesses and curvatures contribute to lower replication yields. Planar substrates 211 and 212 have respective thicknesses 241 and 242. Resin lenses 221-224 have respective maximum thicknesses 243-246. Thicknesses 243-246 place a lower limit on height 202. For example, thicknesses 244 and 245 place a lower limit on a distance 204 between planar substrates 211 and 212. If lens 200 is used in mobile device 190, thicknesses 243-246 place a lower limit on the thickness of camera module 192, and hence constrains how thin mobile device 190 can be.

#FIG. 1 shows a wafer-level lens incorporated into a camera module of a mobile device.

#FIG. 2 is a cross-sectional view of a prior-art lens that is an example of the wafer-level lens of FIG. 1.

#FIG. 3 is a cross-sectional view of a wafer-level hybrid compound lens that may function as the wafer-level lens of FIG. 1, in an embodiment.

#FIG. 3 is a cross-sectional view of a wafer-level hybrid compound lens 300 that may function as the wafer-level lens 100 in mobile device 190. Wafer-level hybrid compound lens 300 includes a substrate lens 320 and resin lenses 310 and 330, which are each a meniscus lens. Substrate lens 320 has a top surface 321 and a bottom surface 322. Top surface 321 includes surfaces 321(1, 2) where surface 321(1) is planar and surface 321(2) is non-planar. Bottom surface 322 includes surfaces 322(1, 2) where surface 322(1) is planar and surface 322(2) is non-planar. Resin lens 310 has non-planar surfaces 311 and 312. Resin lens 330 has non-planar surfaces 331 and 332. Non-planar surface 312 of resin lens 310 adjoins surface 321(2) of substrate lens 320. Similarly, non-planar surface 331 of resin lens 330 adjoins surface 322(2) of substrate lens 320.

#Substrate lens 320 includes a flange 325 that has an edge thickness 341. Flange 325 includes surfaces 321(1) and 322(1), which may also be denoted as flange surfaces. Resin lens 310 has a maximum height 343 above surface 321(1). Non-planar surface 311 of resin lens 310 may be entirely on one side of surface 321(1). For example, surface 321(1) may be planar and reside in a plane 323 such that resin lens 310 may be entirely on one side of plane 323. Non-planar surface 332 of resin lens 330 may be entirely on one side of a plane 324 that includes surface 322(1). A portion of one or both resin lens 310 and resin lens 330 may extend onto flange 325 without departing from the scope hereof. For example, a portion of resin lens 310 in region 313 is on surface 321(1) of flange 325.

#Substrate lens 320 has an optical axis 306. At least one of resin lenses 310 and 330 are coaxial with substrate lens 320. Substrate lens 320 has a center thickness 328 that may exceed maximum height 343 of resin lens 310. Center thickness 328 may be less than maximum height 343 without departing from the scope hereof.