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US 9,804,350 B2Granted
Method of forming a hermetically sealed fiber to chip connections
AssigneeMicron Technology, Inc.
InventorsRoy Meade, Gurtej Sandhu
Life of this patent
Estimating the term…
Abstract
Disclosed are methods of providing a hermetically sealed optical connection between an optical fiber and an optical element of a chip and a photonic-integrated chip manufactured using such methods.
Claims14
An optical device, comprising:
- a photonic-integrated chip on which an optical waveguide is formed, the photonic-integrated chip having a surface with a flat base surface and a chamfered surface adjacent to the base surface;
- and
- an optical fiber assembly comprising an optical fiber having a flat terminating end surface and an adjacent chamfered surface, wherein the terminating end surface and the chamfered surface of the optical fiber are pre-activated in a plasma to create dangling bonds on the terminating end surface and the chamfered surface of the optical fiber which facilitate coupling with the optical waveguide,
- wherein the terminating end surface of the optical fiber directly contacts the base surface of the photonic-integrated chip and the chamfered surface of the optical fiber matches and aligns with the chamfered surface of the photonic-integrated chip, thereby providing a hermetically sealed optical connection between the optical fiber and the optical waveguide formed in the photonic-integrated chip.
1 more element
An optical device, comprising:
- an optical fiber having a flat terminating end surface and an adjacent chamfered surface;
- an optical chip having a surface with a flat base surface and a chamfered surface adjacent to the base surface,
- wherein the optical fiber is coupled to the optical chip such that the terminating end surface of the optical fiber is connected to the base surface of the chip and the chamfered surface of the optical fiber matches and aligns with the chamfered surface of the optical chip,
- wherein the optical fiber is pre-activated in a plasma to create dangling bonds on the terminating end surface and the chamfered surface of the optical fiber, and wherein the optical fiber forms at least one covalent bond directly with the optical chip.
1 more element
Dependencies are inferred from the claim text.