Fiber to chip optical coupler
AssigneeTeramount Ltd.
InventorsAbraham Israel, Hesham Taha
Life of this patent
Estimating the term…
Abstract
An optical coupler for coupling an optical fiber to a photonic integrated circuit (PIC) is presented. The optical coupler comprises a first curved mirror included in a first substrate layer of the PIC and at a first predefined lateral distance from an optical transceiver associated with the PIC; a second curved mirror included in a second substrate layer and placed at a second predefined lateral distance from the optical fiber; and a spacer located between the first substrate layer and the second substrate layer.
Claims25
An optical coupler for coupling an optical fiber to a photonic integrated circuit (PIC), comprising:
- a first curved mirror included in a first substrate layer of the PIC and at a first predefined lateral distance from an optical transceiver associated with the PIC, the first curved mirror is structured to reflect all wavelengths of light incident thereupon;
- a second curved mirror included in a second substrate layer and placed at a second predefined lateral distance from the optical fiber, the second curved mirror is structured to reflect all wavelengths of light incident thereupon;
- a spacer located between the first substrate layer and the second substrate layer;
- and
- a tilted flat mirror included in the second substrate layer and adjoined to the optical fiber, wherein the tilted flat mirror is tilted at a predefined angle.
A method for manufacturing an optical coupler for coupling an optical fiber to a photonic integrated circuit (PIC), comprising:
- fabricating, in a first substrate layer, a first curved mirror, wherein the first substrate layer is part of the PIC, the first curved mirror is structured to reflect all wavelengths of light incident thereupon;
- fabricating, in a second substrate layer, a second curved mirror, the second curved mirror is structured to reflect all wavelengths of light incident thereupon;
- and
- disposing a spacer between the first substrate layer and the second substrate layer;
- and
- fabricating a tilted flat mirror at a predefined angle in the second substrate layer.
A photonic plug, comprising:
- a plurality of optical couplers enabling optical connectivity between a plurality of optical fibers and a photonic integrated circuit (PIC) disposed on a first substrate layer, wherein each of the plurality of optical couplers includes a second substrate layer, at least one optical focusing element, a tilted flat mirror tilted at a predefined angle, a fiber trench etched in the second substrate layer, and a spacer located between the first substrate layer and the second substrate layer.
A photonic integrated circuit (PIC) package, comprising:
- a first substrate layer including at least a first curved mirror, the first curved mirror is structured to reflect all wavelengths of light incident thereupon;
- a second substrate layer including at least a second curved mirror and a tilted flat mirror, wherein the second curved mirror is structured to reflect all wavelengths of light incident thereupon and the tilted flat mirror is tilted at a predefined angle;
- and
- a spacing layer coupling between the first substrate layer and the second substrate layer.
Dependencies are inferred from the claim text.