Systems and methods for conforming test tooling to integrated circuit device with heater socket
AssigneeEssai, Inc.
InventorsNasser Barabi, Chee Wah Ho, Joven R. Tienzo, Oksana Kryachek, Elena V. Nazarov
Life of this patent
Estimating the term…
Abstract
A laminated heater socket useful in association with an integrated circuit (IC) device tester is having a socket with an embedded integrated heater. This laminated heater socket configuration allows for good thermal conductivity and better electrical signal transmission specially for testing high-speed integrated circuits.
Claims19
A coaxial test socket assembly useful in association with an integrated circuit (IC) device tester having a thermal control unit (TCU), the coaxial socket assembly comprising:
- a socket contactor frame with an opening configured to accommodate an IC device under test (DUT);
- a supplemental embedded heater module having a heating plate, the embedded heater module having a recess configured to provide access to the DUT, and wherein the coaxial test socket assembly becomes an integral part of a thermal conduction path to a thermal control unit (TCU) of an integrated circuit (IC) device tester during testing of an IC device, wherein the embedded heater module supplements thermal control of the TCU, and wherein the supplemental embedded heater module and the TCU are configured to provide independent thermal control to opposing surfaces of the DUT thereby providing a thermal soak for the DUT to prevent thermal leak, achieving good thermal gradient, and enabling speedy temperature ramp for increased test throughput;
- an array of coaxial pins having good thermal conductivity and good electrical signal transmission is configured to contact the DUT, wherein each of the coaxial pins includes:
- a spring-loaded metallic plunger;
- a metallic barrel wherein the spring-loaded metallic plunger can move inside the metallic barrel;
- and
- an insulating layer substantially surrounding the metallic barrel;
- a socket base hosting the top part of the array of coaxial pins;
- and
- a socket bottom hosting the bottom part of the array of coaxial pins.
A thermal control unit (TCU) useful in association with an IC tester, the TCU is configured to maintain a set point temperature on an IC device under test (DUT) and operatively coupled to a test socket assembly, the TCU comprising:
- a pedestal assembly with a heat-conductive pedestal having a bottom end configured to contact the die of the DUT;
- a temperature-control fluid circulation block;
- a thermally-conductive heater having a fuse coupled to a heating element;
- a substrate pusher configured to contact the substrate of the DUT;
- a controllable force distributor configured to receive a force and controllably distribute such force between the pedestal assembly and the substrate pusher;
- and
- a coaxial test socket assembly including:
- a socket contactor frame with an opening configured to accommodate an IC device under test (DUT);
- a supplemental embedded heater module having a heating plate, the embedded heater module having a recess configured to provide access to the DUT, wherein the coaxial test socket assembly becomes an integral part of a thermal conduction path to a thermal control unit (TCU) of an integrated circuit (IC) device tester during testing of an IC device wherein the embedded heater module supplements thermal control of the TCU, and wherein the supplemental embedded heater module and the TCU are configured to provide independent thermal control to opposing surfaces of the DUT thereby providing a thermal soak for the DUT to prevent thermal leak, achieving good thermal gradient, and enabling speedy temperature ramp for increased test throughput;
- an array of coaxial pins having good thermal conductivity and good electrical signal transmission is configured to contact the DUT, wherein each of the coaxial pins includes:
- a spring-loaded metallic plunger;
- a metallic barrel wherein the spring-loaded metallic plunger can move inside the metallic barrel;
- and
- an insulating layer substantially surrounding the metallic barrel;
- a socket base hosting the top part of the array of coaxial pins;
- and
- a socket bottom hosting the bottom part of the array of coaxial pins.
Dependencies are inferred from the claim text.