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US 9,804,007 B2Granted
Device and method for sensor calibration
AssigneeInvenSense, Inc.
InventorsWesley James Emmanouel Teskey, Nim Hak Tea
Life of this patent
Estimating the term…
Abstract
A device and method for a MEMS device with at least one sensor is disclosed. A thermal element is disposed adjacent the MEMS device to selectively adjust a temperature of the MEMS device. A calibration operation is initiated for the sensor to determine a correction value to be applied to the sensor measurement based on the temperature. The correction value is stored.
Claims26
A device, comprising:
- a MEMS device with at least one sensor;
- a thermal element disposed adjacent the MEMS device, the thermal element configured to selectively adjust a temperature of the MEMS device;
- and
- an adhesive layer disposed adjacent to the MEMS device, the thermal element disposed within the adhesive layer and the adhesive layer attaches the thermal element to the MEMS device.
1 more element
A device, comprising:
- a MEMS device with at least one sensor;
- a thermal element disposed adjacent the MEMS device, the thermal element configured to selectively adjust a temperature of the MEMS device;
- a circuit board is disposed adjacent the thermal element and the MEMS device is attached to the circuit board,
- wherein at least one board thermal spreader is disposed about the circuit board to substantially maintain a uniform temperature about the circuit board;
- wherein the at least one board thermal spreader is disposed within the circuit board;
- and
- wherein the circuit board is a laminate board with at least one thermally conductive layer, the at least one thermally conductive layer configured to be a board thermal spreader.
4 more elements
A device, comprising:
- a MEMS device with at least one sensor;
- a thermal element disposed adjacent the MEMS device, the thermal element configured to selectively adjust a temperature of the MEMS device;
- an adhesive layer disposed adjacent to the MEMS device, the thermal element disposed within the adhesive layer and the adhesive layer attaches the thermal element to the MEMS device;
- and
- a processor with a calibration logic configured to
- selectively energize the thermal element to adjust a temperature of the MEMS device, adjusted temperature measured by a temperature sensor;
- initiate a calibration operation for the sensor to determine a correction value to be applied to the sensor measurement based on the adjusted temperature of the MEMS device;
- and
- store the correction value.
6 more elements
A method, comprising:
- providing a MEMS device with at least one sensor;
- disposing a thermal element adjacent the MEMS device;
- selectively energizing the thermal element to adjust the temperature of the MEMS device;
- initiating a calibration operation for the sensor to determine a correction value to be applied to the sensor measurement based on the temperature;
- and
- storing the correction value, the method further including,
- selectively choosing a first correction value and corresponding first temperature;
- selectively maintaining the MEMS device temperature at the first temperature by selectively energizing the thermal element;
- and
- applying the first correction value to the sensor measurement.
7 more elements
Dependencies are inferred from the claim text.