Cooling assemblies having porous three dimensional surfaces

A cooling assembly comprising:

• a heat transfer substrate having a surface;
• an array of thermally conductive fins comprising one or more surfaces, the array of thermally conductive fins being integrally formed with and extending from the surface of the heat transfer substrate;
• and
• a metal mesh that is diffusion bonded to the surfaces of the array of thermally conductive fins and a surface of the heat transfer substrate between adjacent thermally conductive fins of the array of thermally conductive fins, the metal mesh conforming entirely to each of the one or more surfaces of the array of thermally conductive fins and defining a macro-porosity.

A cooling assembly comprising:

• a heat transfer substrate having a surface;
• a thermally conductive fin comprising one or more surfaces, the thermally conductive fin extending from the surface of the heat transfer substrate;
• a metal mesh bonded to each of the one or more surfaces of the thermally conductive fin, the metal mesh conforming entirely to each of the one or more surfaces of the thermally conductive fin and defining a macro-level porosity;
• and
• sintered metal particles that are at least one of sintered and diffusion bonded to the metal mesh and the surfaces of the thermally conductive fin to form a layer of sintered metal particles, the sintered metal particles defining a micro-level porosity, wherein an average diameter of the sintered metal particles increases from a base of the thermally conductive fin to a top of the thermally conductive fin.