Liquid cooling
AssigneeHewlett Packard Enterprise Development LP
InventorsJohn P Franz, Tahir Cader, Michael L Sabotta, David A Moore
Life of this patent
Estimating the term…
Abstract
An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.
Claims15
An assembly to provide liquid cooling, the assembly comprising:
- a thermal member including an array of cooling pins, the array of cooling pins extend from the thermal member, the array of cooling pins formed of a thermally conductive material;
- a support member including an inlet channel and an outlet channel, the inlet channel to provide a fluid to the array of cooling pins, the outlet channel to receive the fluid from the array of cooling pins;
- and
- a gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween, wherein the gasket comprises a seal member to extend between the thermal member and the support member, and wherein the seal member selectively compresses to align a mating member flush with a heat block that receives heat from an electronic device.
A cooling system to provide liquid cooling comprising:
- a thermal member including an array of cooling pins, the array of cooling pins extend from the thermal member, the array of cooling pins formed of a thermally conductive material;
- a support member including an inlet channel and an outlet channel, the inlet channel to provide a fluid to the array of cooling pins, the outlet channel to receive the fluid from the array of cooling pins;
- a gasket between the thermal member and the support member to form a fluid tight seal therebetween, wherein the gasket comprises a seal member to extend between the thermal member and the support member, and wherein the seal member selectively compresses to align a mating member flush with a heat block that receives heat from an electronic device;
- and
- a connector member extending from the support member to provide movement of the support member during alignment of the thermal member with the heat block.
An assembly to provide liquid cooling, the assembly comprising:
- a thermal member including an array of cooling pins, the array of cooling pins extend from the thermal member, the array of cooling pins formed of a thermally conductive material;
- a support member including an inlet channel and an outlet channel, the inlet channel to provide a fluid to the array of cooling pins, the outlet channel to receive the fluid from the array of cooling pins;
- and
- a gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween, wherein the gasket comprises a seal member to engage with the support member, the seal member including a flexible side wall that extends from the thermal member and selectively compresses to align the mating member flush with a heat block that receives heat from an electronic device.
Dependencies are inferred from the claim text.