Mounting arrangement and method for light emitting diodes
AssigneeFPT Acquisition Corp.
InventorsJohn Popovich, Gregory W. Honegger
Life of this patent
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Abstract
A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.
Claims14
An illumination apparatus, comprising:
- a housing comprising a plurality of wall surfaces that define a channel;
- and
- an illumination module mounted on one of the plurality of wall surfaces, the illumination module comprising:
- a dielectric having a first side and a second side;
- a light emitting diode (LED);
- a plurality of electrically conductive contacts on the first side of the dielectric, each of the plurality of contacts being configured to mount a lead of the LED such that the LED is electrically connected to the contacts;
- and
- a heat conductive body on the second side of the dielectric, the dielectric being in contact with a first side of the heat conductive body;
- wherein heat from the LED flows through the contacts and dielectric to the heat conductive body, and from the body to the one of the plurality of wall surfaces.
An illumination apparatus, comprising:
- a heat conductive body having a first side and a second side, the heat conductive body having a thermal conductivity greater than about 100 W/mK;
- a thin dielectric layer having a first side and a second side, the second side of the thin dielectric layer being in contact with the first side of the heat conductive body;
- a plurality of light emitting diodes (LEDs);
- and
- a plurality of electrically-conductive contacts on the first side of the dielectric layer, the LEDs being mounted to the contacts such that the LEDs are electrically connected to one another, the contacts thermally communicating with the dielectric layer through a first thermal communication area between the contacts and the first side of the dielectric layer, the first thermal communication area defined as the combined surface area of the plurality of contacts that is in contact with the first side of the dielectric layer;
- wherein the second side of the dielectric layer is arranged on the first side of the heat conductive body so that the first side of the heat conductive body is in thermal communication with the plurality of contacts through the dielectric portion;
- wherein the first side of the heat conductive body has a surface area larger than the first thermal communication area;
- and
- wherein heat is thermally communicated from the LEDs to the heat conductive body.
Dependencies are inferred from the claim text.