Circuit substrate for carrying at least one light-emitting diode and light-emitting structure for providing illumination

A circuit substrate for carrying at least one light-emitting diode, comprising:

• an insulation base layer;
• a conductive heat-dissipating layer disposed on the insulation base layer;
• an embedded insulation layer disposed on the conductive heat-dissipating layer;
• an embedded conductive layer disposed on the embedded insulation layer;
• an insulation covering layer disposed on the embedded conductive layer;
• a conductive circuit structure including at least one first electrode conductive layer and at least one second electrode conductive layer, wherein the at least one first electrode conductive layer and the at least one second electrode conductive layer are disposed on the insulation covering layer and separated from each other;
• and
• a conductive through structure including at least one through hole passing through the insulation covering layer and a conductive body for filling the at least one through hole, wherein both the at least one through hole and the conductive body are connected between the embedded conductive layer and the at least one second electrode conductive layer;
• wherein the at least one light-emitting diode is disposed on the conductive circuit structure and electrically connected between the at least one first electrode conductive layer and the at least one second electrode conductive layer;
• wherein only the at least one second electrode conductive layer is electrically connected to the embedded conductive layer through the conductive body, and thus the at least one light-emitting diode is electrically grounded through the at least one second electrode conductive layer, the conductive body, and the conductive heat-dissipating layer.

A light-emitting structure for providing illumination, comprising:

• a circuit substrate comprising:
• an insulation base layer;
• a conductive heat-dissipating layer disposed on the insulation base layer;
• an insulation covering layer disposed on the conductive heat-dissipating layer;
• a conductive circuit structure including at least one first electrode conductive layer and at least one second electrode conductive layer, wherein the at least one first electrode conductive layer and the at least one second electrode conductive layer are disposed on the insulation covering layer and separated from each other;
• and
• a conductive through structure including at least one through hole passing through the insulation covering layer and a conductive body for filling the at least one through hole, wherein both the at least one through hole and the conductive body are connected between the conductive heat-dissipating layer and the at least one second electrode conductive layer, and one of the at least one first electrode conductive layer and the at least one second electrode conductive layer is electrically connected to the conductive heat-dissipating layer through the conductive body;
• and
• a light-emitting unit including at least one light-emitting diode disposed on the conductive circuit structure and electrically connected between the at least one first electrode conductive layer and the at least one second electrode conductive layer
• wherein only the at least one second electrode conductive layer is electrically connected to the conductive heat-dissipating layer through the conductive body, and thus the at least one light-emitting diode is electrically grounded through the at least one second electrode conductive layer, the conductive body, and the conductive heat-dissipating layer.