Method of electroless deposition of aluminum or aluminum alloy, an electroless plating composition, and an article including the same
AssigneeHRL Laboratories, LLC
InventorsJohn H. Martin, Joanna A. Kolodziejska, John J. Vajo, Jason A. Graetz, Christopher S. Roper
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Abstract
A method for electroless deposition of aluminum on a substrate includes: activating the substrate; providing an aluminum ionic liquid; adding a reducing agent and an additive to the aluminum ionic liquid to form an electroless plating composition, wherein the additive may include a catalyst, an alloying element, or a combination thereof; and immersing the substrate in the electroless plating composition to have an aluminum layer deposited on the substrate. An article includes the electroless deposited aluminum layer.
Claims12
A method for electroless deposition of aluminum on a substrate, the method comprising:
- activating the substrate;
- providing an aluminum ionic liquid;
- adding a reducing agent and an additive to the aluminum ionic liquid to form an electroless plating composition, wherein the additive comprises a catalyst selected from the group consisting of TiCl2, TiCl3, TiCl4, ZrCl4, VCl3, NbCl5, CeCl3 and combinations thereof;
- and
- immersing the activated substrate in the electroless plating composition.
Dependencies are inferred from the claim text.