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US 9,803,112 B2Granted
Pressure sensitive adhesive film and method of manufacturing organic electronic device using the same
AssigneeLG Chem, Ltd.
InventorsHyun Jee Yoo, Suk Ky Chang, Yoon Gyung Cho, Kyung Yul Bae
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Abstract
Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.
Claims16
A pressure-sensitive adhesive film, comprising:
- a pressure-sensitive adhesive having an elastic portion (Ep) calculated by Equation 1 of 20 to 80%,
- wherein the pressure-sensitive adhesive film has a water vapor transmission rate in a thickness direction of 50 g/m2·day or less:
- Ep (unit:
- %)=100×σ2/σ1 [Equation 1]
- wherein σ1 is the maximum stress value measured when 50% strain is applied to the film by applying 200 gf of normal force with a parallel plate in a relaxation test mode at 80° C. using an advanced rheometric expression system (ARES) while a pressure-sensitive adhesive film is manufactured to have a thickness of 600 μm, and σ2 is a stress value measured after the film is maintained for 180 seconds while the strain is applied to the film.
2 more elements
Dependencies are inferred from the claim text.