Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device
AssigneeHitachi Chemical Company, Ltd.
InventorsKazutaka Honda, Akira Nagai, Makoto Satou
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Abstract
An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1): wherein R1 represents an electron-donating group.
Claims13
An adhesive for a semiconductor, comprising an epoxy resin in an amount of 5 to 75% by mass based on the total amount of the adhesive, a curing agent, a phenoxy resin, at least one compound selected from a group consisting of methylsuccinic acid, 2-methylglutaric acid, 2-methyladipic acid, 2-methylpimelic acid, and 2-methylsuberic acid in an amount of 0.5 to 10% by mass based on the total amount of the adhesive, and resin fillers,
- wherein a mass ratio of the content of the epoxy resin to the content of the phenoxy resin is 0.01 to 5.
A fluxing agent, comprising at least one compound selected from a group consisting of methylsuccinic acid, 2-methyiglutaric acid, 2-methyladipic acid, 2-methylpimelic acid, and 2-methylsuberic acid, wherein the fluxing agent is blended in an adhesive for a semiconductor comprising an epoxy resin in an amount of 5 to 75% by mass based on the total amount of the adhesive, a curing agent, a phenoxy resin, the fluxing agent in an amount of 0.5 to 10% by mass based on the total amount of the adhesive, and resin fillers, and a mass ratio of the content of the epoxy resin to the content of the phenoxy resin is 0.01 to 5.
A fluxing agent, comprising at least one compound selected from a group consisting of methylsuccinic acid, 2-methyiglutaric acid, 2-methyladipic acid, 2-methylpimelic acid, and 2-methylsuberic acid, wherein the fluxing agent is configured to be blended in an adhesive for a semiconductor such that the adhesive comprises an epoxy resin in an amount of 5 to 75% by mass based on the total amount of the adhesive, a curing agent, a phenoxy resin, the fluxing agent in an amount of 0.5 to 10% by mass based on the total amount of the adhesive, and resin fillers, and a mass ratio of the content of the epoxy resin to the content of the phenoxy resin is 0.01 to 5.
Dependencies are inferred from the claim text.