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AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorsYi Guo, David Mosley, David L. Thorsen
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The present invention provides aqueous chemical mechanical planarization (CMP) polishing compositions have excellent heat aging and shelf stability in the form of concentrates comprising a mixture of a compound containing two quaternary ammonium groups, such as hexabutyl C1-C8 alkanediammonium dihydroxides or salts thereof, preferably N,N,N,N′,N′,N′-hexabutyl-1,4-butanediammonium dihydroxide (HBBAH), and aminosilane group containing silica particles in the amount of from 1 to 30 wt. % or, preferably, from 15 to 22 wt. %, as solids based on the total weight of the composition, the composition having a pH ranging from 3 to 5 or, preferably, from 3.5 to 4.5 wherein the composition is stable against visible precipitation or sedimentation at a 15 wt. % solids content after heat aging at a temperature of 45° C. for at least 6 days.
An aqueous chemical mechanical planarization (CMP) polishing composition comprising a mixture of a compound containing two quaternary ammonium groups, and aminosilane group containing silica particles containing one or more cationic nitrogen atom in the amount of from 1 to 30 wt. % as solids, based on the total weight of the composition, the composition having a pH ranging from 3 to 5, wherein the total amount of cationic nitrogen atoms from the aminosilane on the silica particles and the compound containing two quaternary ammonium groups ranges from 170 to 500 nM/m2 silica particles in the aqueous CMP polishing composition, and, further wherein, the composition is stable against visible precipitation or sedimentation at a 15 wt. % solids content after heat aging at a temperature of 45° C. for at least 6 days.
Dependencies are inferred from the claim text.