Aqueous primer composition for enhanced film formation and method of using the same
AssigneeCytec Industries Inc.
InventorsYiqiang Zhao, Dalip K. Kohli, Gaurang Kunal Shah
Life of this patent
Estimating the term…
Abstract
A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.
Claims5
A water-based primer composition that has a pH within the range of 6-8 and can be sprayed, the primer composition comprising:
- (i) 20-60 wt. % one or more epoxy resins;
- (ii) 2-30 parts curing agent, solely or in combination with one or more catalysts, per 100 parts of epoxy resin(s) in total;
- (iii) organosilane in an amount of 0.1 to 10 parts per 100 parts of water;
- (iv) 1-10 wt. % propylene carbonate;
- (v) 1-7 wt. % at least one chromate or non-chromate corrosion inhibitor;
- and
- (vi) water to provide 10%-25% solids.
Dependencies are inferred from the claim text.