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US 9,803,073 B2Granted
Heat resistant ethylene vinyl acetate copolymer composition and process for its production
AssigneeE. I. Du Pont de Nemours and Company
InventorsSteven R Oriani, Mark Aaron Stewart
Life of this patent
Estimating the term…
Abstract
Disclosed herein are curable heat resistant ethylene vinyl acetate copolymer-polyamide blend compositions, wherein the ethylene vinyl acetate copolymer has a melting peak temperature of 100° C. or less. The blend compositions comprise 0.1 to 10 weight percent dispersed polyamide, and may be cured to form articles having improved heat resistance while maintaining the desirable physical properties of unmodified, cured ethylene vinyl acetate articles.
Claims19
A heat resistant curable ethylene vinyl acetate (EVA) copolymer-polyamide blend composition comprising:
- (A) from about 99 wt % to about 95 wt % of an EVA component selected from the group consisting of
- (i) one or more amorphous EVA copolymers;
- (ii) one or more EVA copolymers having a melting peak temperature of 100° C. or less;
- and
- (iii) a combination of two or more of the amorphous EVA copolymers and the EVA copolymers having a melting peak temperature of 100° C. or less;
- (B) from about 1 wt % to about 5 wt % of one or more polyamides;
- wherein the weight percent of the polyamides and the EVA component are based on the total combined amount of EVA component and polyamides in the blend composition, the blend composition has a Mooney viscosity determined according to ASTM D1646, ML 1+4 at 100° C. less than 200, and the blend composition comprises polyamide particles dispersed in a continuous EVA copolymer matrix;
- and
- (C) a peroxide curative;
- wherein said curable composition, upon curing, forms a thermoset material.
7 more elements
A process for producing a heat resistant curable EVA copolymer-polyamide blend composition, wherein said curable composition, upon curing, forms a thermoset material;
- said curable composition comprising:
- (A) from about 99.9 wt % to about 90 wt % of an EVA component selected from the group consisting of
- (i) one or more amorphous EVA copolymers;
- (ii) one or more EVA copolymers having a melting peak temperature of 100° C. or less;
- and
- (iii) a combination of two or more of the amorphous EVA copolymers and the EVA copolymers having a melting peak temperature of 100° C. or less;
- (B) from about 0.1 wt % to about 10 wt % of one or more polyamides;
- wherein the weight percent of the polyamides and the EVA component are based on the total combined amount of EVA component and polyamides in the blend composition, the blend composition has a Mooney viscosity determined according to ASTM D1646, ML 1+4 at 100° C. less than 200, and the blend composition comprises polyamide particles dispersed in a continuous EVA copolymer matrix;
- and
- (C) a peroxide curative;
- and
- said process comprising the steps of:
- (A) providing said EVA component;
- (B) providing said one or more polyamides, wherein each of the one or more polyamides has a melting peak temperature;
- (C) mixing the EVA component and the one or more polyamides at a temperature that is:
- (i) greater than the melting peak temperatures of the one or more polyamides;
- and
- (ii) greater than the melting peak temperatures of the one or more EVA copolymers, when the EVA component comprises the one or more EVA copolymers having a melting peak temperature of 100° C. or less;
- wherein said mixing disperses said one or more polyamides in said EVA component to form an EVA copolymer-polyamide blend composition;
- (D) maintaining the temperature of the EVA copolymer-polyamide blend composition at less than 160° C., or cooling the EVA copolymer-polyamide blend composition to a temperature of less than 160° C.
- wherein said temperature of less than 160° C. is below the decomposition temperature of the peroxide and below the temperature at which the crosslinking reaction occurs;
- and
- (E) adding the peroxide curative to the EVA copolymer-polyamide blend composition at the temperature of less than 160° C. to form the heat resistant curable ethylene vinyl acetate (EVA) copolymer-polyamide blend composition.
20 more elements
A process for producing a heat resistant curable EVA copolymer-polyamide blend composition, wherein said curable composition, upon curing, forms a thermoset material;
- said curable composition comprising:
- (A) from about 99.9 wt % to about 90 wt % of an EVA component selected from the group consisting of
- (i) one or more amorphous EVA copolymers;
- (ii) one or more EVA copolymers having a melting peak temperature of 100° C. or less;
- and
- (iii) a combination of two or more of the amorphous EVA copolymers and the EVA copolymers having a melting peak temperature of 100° C. or less;
- (B) from about 0.1 wt % to about 10 wt % of one or more polyamides;
- wherein the weight percent of the polyamides and the EVA component are based on the total combined amount of EVA component and polyamides in the blend composition, the blend composition has a Mooney viscosity determined according to ASTM D1646, ML 1+4 at 100° C. less than 200, and the blend composition comprises polyamide particles dispersed in a continuous EVA copolymer matrix;
- and
- (C) a peroxide curative;
- and
- said process comprising the steps of:
- (A) providing the EVA component;
- (B) providing the one or more polyamides, each of said one or more polyamides having a melting peak temperature that is less than 160° C.;
- (C) providing the peroxide curative;
- and
- (D) mixing the EVA component, the one or more polyamides, and the peroxide curative together at a temperature that is:
- (i) less than or equal to 160° C.;
- (ii) greater than the melting peak temperatures of the one or more polyamides;
- (iii) greater than the melting peak temperatures of the one or more EVA copolymers, when the EVA component comprises the one or more EVA copolymers having a melting peak temperature of 100° C. or less;
- and
- (iv) below the decomposition temperature of the peroxide and below the temperature at which the crosslinking reaction occurs;
- wherein said mixing disperses the peroxide curative and the one or more polyamides in the EVA component and thereby produces the heat resistant curable EVA copolymer-polyamide blend composition.
20 more elements
Dependencies are inferred from the claim text.