MEMS device structure and methods of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChang-Chia Chang, Chen-Chih Fan, Bruce C. S. Chou
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Abstract
A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.
Claims21
A method for forming a microelectromechanical system (MEMS) device comprising:
- forming a MEMS structure over a first substrate, wherein the MEMS structure comprises a movable element and a static element;
- forming an interconnect structure on a second substrate;
- before the forming the interconnect structure, forming a contact pad on a top surface of the second substrate;
- depositing a first dielectric layer on the interconnect structure;
- and
- bonding the MEMS structure to the first dielectric layer, the bonding forming a cavity surrounding the movable element, the static element forming at least part of a first supporting post in the cavity, the first supporting post configured to support the second substrate;
- thinning a backside of the second substrate;
- forming an opening in the backside of the second substrate, wherein a bottom surface of the opening adjoins the contact pad;
- depositing a conductive material on the backside of the second substrate and in the opening;
- and
- patterning the conductive material to form a via in the opening and contact pads on the backside of the second substrate.
A method for forming a microelectromechanical system (MEMS) device comprising:
- forming a MEMS structure over a first substrate, the MEMS structure comprising a movable element and a static element, the forming the MEMS structure comprising:
- the forming the MEMS structure further comprises:
- depositing a first dielectric layer on the first substrate;
- forming openings in the first dielectric layer;
- depositing a protective component in the openings;
- bonding a MEMS wafer to the first dielectric layer;
- and
- patterning the MEMS wafer to form the movable element, the movable element encircling a central static element, and the movable element being encircled by an outer static element;
- forming an interconnect structure on a second substrate;
- depositing a second dielectric layer on the interconnect structure;
- and
- bonding the MEMS structure to the second dielectric layer, the bonding forming a cavity surrounding the movable element, the static element forming at least a portion of a first supporting post in the cavity.
A MEMS device comprising:
- a MEMS structure above a first substrate, the MEMS structure comprising a movable element, a central static element, and an outer static element, the movable element being suspended above the first substrate, the movable element being laterally separated from the outer static element by a first spacing, and the movable element being laterally separated from the central static element by a second spacing;
- a central portion of a bonding material between the first substrate and a bottom surface of the central static element;
- a second substrate above the MEMS structure;
- a central portion of a first dielectric layer between the second substrate and a top surface of the central static element;
- and
- a supporting post, the supporting post comprising:
- the central portion of the bonding material, the central static element, and the central portion of the first dielectric layer, wherein the movable element encircles the central static element and the outer static element encircles the movable element.
Dependencies are inferred from the claim text.