Wafer level package for a MEMS sensor device and corresponding manufacturing process

A process for manufacturing a MEMS device package, the process comprising:

• forming a stack of a first die and a second die, the stack defining a first internal surface and supporting an electrical contact pad and a first external surface that forms a first outer face of the package;
• coating at least a part of the stack and the first internal surface with a mold compound, the mold compound having lateral surfaces and a front surface, the front surface defining at least part of a second outer face of the package opposite to the first outer face;
• and
• forming a vertical connection structure and an external connection element, the vertical connection structure having a first surface in contact with the contact pad at the first internal surface, the external connection element having a second surface arranged at the front surface of the mold compound and electrically coupled to the vertical connection structure, the vertical connection structure including a lateral face that is exposed from the lateral surfaces of the mold compound.

A package comprising:

• a first die coupled to a first surface of a second die, the second die having a second surface that forms an outer surface of the package;
• a contact pad on the first surface of the second die that is located outward from the first die;
• a mold compound on the first surface and along sides surfaces of the first die, the mold compound having a recess or opening that extends across a thickness of the mold compound;
• and
• a vertical connection structure located in the recess or opening of the mold compound and coupled to the contact pad, the vertical connection structure having a lateral surface that is exposed from the mold compound, a first surface that is in contact with the contact pad, and a second surface opposite the first surface.