Structural member for electronic devices
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTakatoshi Abe, Tomoaki Sawada, Shingo Yoshioka
Life of this patent
Estimating the term…
Abstract
Provided is a structural member for electronic devices which uses a material that is flexible and has excellent restoration properties after extension and stress relaxation properties. The structural member for electronic devices has the following properties A and B: (Property A) In a case where predetermined deformation is applied, stress that applies the deformation is relaxed (reduced) with time: and (Property B) In a case where the stress that applies deformation is 0, the deformation rarely remains while a resin composition is recovered. That is, when stress is 0, residual strain substantially becomes 0 (specifically 3% or lower).
Claims14
A structure for electronic structural member for electronic devices comprising:
- a resin composition;
- and
- an electronic element of which a portion comes into close contact with the resin composition,
- wherein, in the resin composition, stress generated due to any deformation caused by given strain decreases with time, and the resin composition recovers a shape before the deformation when the stress becomes approximately 0,
- wherein the resin composition contains at least (A) a polyrotaxane, (B) an epoxy resin, and (C) a curing agent, and
- wherein the proportion of epoxy resin in 30 to 50 parts by mass with respect to 100 parts by mass of polyrotaxane, epoxy resin, and curing agent.
Dependencies are inferred from the claim text.