Apparatus and method for a molded plastic fin shell for electronic devices

A method of operation of an electronics device including heat sink components, the method comprising:

• dissipating heat from a radio frequency (RF) circuit component mounted on a printed circuit board (PCB) of the electronics device to a metal heat sink plate in contact with the PCB, the RF circuit component disposed between the PCB and the metal heat sink plate;
• dissipating heat from a power supply component of the electronics device to a metal heat sink cylinder surrounding the power supply component and in contact with the metal heat sink plate;
• dissipating the heat from the metal heat sink plate and the metal heat sink cylinder to an external medium through a thermal plastic fin shell surrounding and in contact with the metal heat sink plate and the metal heat sink cylinder;
• and
• communicating with an external electronics device via a data port positioned on the thermal plastic fin shell.

A gateway device including heat sink components, the gateway device comprising:

• a printed circuit board (PCB);
• a heat sink plate connected to the PCB;
• an radio frequency (RF) circuit component mounted on the PCB, the RF circuit component disposed between the PCB and the heat sink plate;
• a power supply component electrically connected to the RF circuit component;
• a heat sink cylinder surrounding the power supply component and in contact with the heat sink plate;
• a thermal plastic fin shell composed of a thermal plastic material, the thermal plastic fin shell surrounding and in contact with each of the heat sink plate and the heat sink cylinder;
• at least one casing part in contact with the thermal plastic fin shell and covering the PCB and the heat sink plate;
• and
• an ON and OFF switch positioned on the casing part.

A method of operation of an electronics device including heat sink components, the method comprising:

• dissipating heat from a radio frequency (RF) circuit component mounted on a printed circuit board (PCB) of the electronics device to a metal heat sink plate in contact with the PCB, the RF circuit component disposed between the PCB and the metal heat sink plate;
• dissipating heat from a power supply component of the electronics device to a metal heat sink cylinder surrounding the power supply component and in contact with the metal heat sink plate;
• dissipating the heat from the metal heat sink plate and the metal heat sink cylinder to an external medium through a thermal plastic fin shell surrounding and in contact with the metal heat sink plate and the metal heat sink cylinder;
• and
• indicating an operation status of the electronics device via an ON and OFF light positioned on a casing, the casing in contact with the thermal plastic fin shell and covering the PCB and the metal heat sink plate.