Solder supply device including a sensor to detect movement of a solder container

A solder supply device comprising:

• a solder container housing liquid solder that includes a tubular section, an opening at a first end, and a bottom at a second end, the solder container including a flange section closer to the first end of the solder container than to the second end of the solder container:
• an outer tube that is tubular with an opening at a first end of the outer tube and a bottom at a second end of the outer tube, the outer tube slidably stores the solder container inside the outer tube, the outer tube including a first inner circumferential surface closer to the first end of the outer tube and a second inner circumferential surface closer to the second end of the outer tube, an inside diameter of the first inner circumferential surface being greater than an outer diameter of the flange section of the solder container, and an inside diameter of the second inner circumferential surface being greater than an outer diameter of the tubular section of the solder container:
• an inner tube including a cylindrical tube section and a ring section which covers an edge of the cylindrical tube section of the inner tube;
• and
• a supply nozzle including a nozzle section and a flange section, for ejecting solder from the solder container, that is inserted into the solder container, and
• wherein the flange section of the supply nozzle is fixedly provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder container from the opening of the solder container,
• wherein the supply nozzle is fixedly held by the ring section of the inner tube,
• wherein the solder supply device supplies solder from a tip of the nozzle section by moving the solder container such that the flange section of the supply nozzle advances inside the solder container and the solder exits the supply nozzle via a nozzle hole in the nozzle section, the solder container being moved by air being supplied to an air chamber that is demarcated by the second end of the solder container and the second end of the outer tube such that the bottom of the solder container moves towards the supply nozzle, and
• wherein the solder supply device includes
• a magnet provided on an outer circumferential surface of the solder container, and
• a sensor provided at a fixed position facing the outer circumferential surface of the solder container so as to detect an approaching of the magnet due to movement of the solder container.