System for coupling a conductive substrate to a ribbon cable

A system for mechanically and electrically coupling a conductive substrate to a multi-conductor insulated cable using a wire crimp, the system comprising;

• a substantially planar backplate, a driver which travels along an axis normal to the backplate wherein the driver is sized and shaped to urge the wire crimp through the substrate and cable, a carrier for positioning the wire crimp over a specific conductor of the cable before it is driven therethrough wherein there is a lateral movement system selected from one of a pattern of grooves extending along the long axis of the cable wherein the pattern is wider than the cable and the cable can be positioned laterally therewithin, an electronically driven linear actuator which positions the cable laterally relative to the driver, a manually adjustable screw-driven linear actuator which translates the carrier laterally.