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US 9,797,057 B2Granted
Magnetic electro-plating
AssigneeEmpire Technology Development LLC
InventorEzekiel Kruglick
Life of this patent
Estimating the term…
Abstract
The present disclosure generally relates to techniques for magnetic electro-plating or electro-deposition. Example methods may include utilizing a magnet during electro-deposition to modify kinetics of deposition of plating material on a substrate.
Claims7
A method for electro-depositing a plating material on a surface of a substrate, the method comprising:
- at least partially submerging the substrate in an electrolyte solution including the plating material, wherein the plating material includes ferrous species, and wherein the substrate includes a first surface on which the plating material is to be deposited;
- positioning an electrode to face the first surface of the substrate;
- positioning one or more permanent magnets to face a second surface of the substrate, the second surface being opposite to the first surface;
- positioning a first electromagnet to face the second surface of the substrate, wherein the first electromagnet, by virtue of its position, enhances kinetics of deposition of the plating material on the first surface of the substrate;
- positioning a second electromagnet to face the first surface of the substrate, wherein the second electromagnet, by virtue of its position, reduces the kinetics of deposition of the plating material on the first surface of the substrate;
- applying an electrical signal to the electrode to cause the plating material to deposit on the first surface of the substrate, wherein the electrical signal varies over time in a pre-determined pattern, and wherein the pre-determined pattern over time is controlled by a signal generator;
- and
- alternately turning on the first electromagnet and the second electromagnet to speed up and slow down the deposition of the plating material on the first surface of the substrate.
5 more elements
A method for electro-depositing a plating material on a surface of a substrate, the method comprising:
- at least partially submerging the substrate in an electrolyte solution including the plating material, wherein the plating material includes ferrous species, and wherein the substrate includes a first surface on which the plating material is to be deposited, and a second surface opposite to the first surface;
- positioning an electrode to face the first surface of the substrate;
- positioning one or more permanent magnets underneath the substrate;
- positioning a first electromagnet to face the second surface of the substrate, wherein the first electromagnet, by virtue of its position, enhances kinetics of deposition of the plating material on the first surface of the substrate;
- positioning a second electromagnet to face the first surface of the substrate, wherein the second electromagnet, by virtue of its position, reduces the kinetics of deposition of the plating material on the first surface of the substrate;
- applying an electrical signal to the electrode to cause the plating material to deposit on the surface of the substrate;
- and
- alternately turning on the first electromagnet and the second electromagnet to speed up and slow down the deposition of the plating material on the first surface of the substrate.
5 more elements
Dependencies are inferred from the claim text.