Thermal interface materials with thin film or metallization
AssigneeLaird Technologies, Inc.
InventorsJason L. Strader, Mark Wisniewski, Karen Bruzda, Michael D. Craig
Life of this patent
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Abstract
According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.
Claims20
A thermal interface material assembly for establishing a thermal-conducting heat path from a heat-generating electronic component within an electronic device to a heat dissipating and/or heat spreading member, comprising:
- a thermal interface material comprising silicone, the thermal interface material having a first side and a second side, and which is conformable to a mating surface of the heat-generating electronic component;
- and
- a thin dry material having a thickness less than 0.0001 inches, the dry material disposed along at least a portion of the first side of the thermal interface material,
- wherein the dry material is configured to be releasable from the mating surface of the heat-generating electronic component when in contact therewith and inhibit adherence of the thermal interface material assembly to the mating surface of the heat-generating electronic component, thereby allowing the thermal interface material assembly after being positioned with the dry material against the mating surface of the heat-generating electronic component to release from the mating surface of the heat-generating electronic component and with the dry material remaining disposed along the thermal interface material.
A thermal interface material assembly comprising:
- a thermal interface material having a first side and a second side, and which is conformable to a mating surface;
- and
- a dry material disposed along at least a portion of the first side of the thermal interface material;
- wherein the dry material has a thickness of 5 angstroms or less;
- wherein the dry material is configured to be releasable from a mating component when in contact therewith and inhibit adherence of the thermal interface material assembly to the mating component, thereby allowing the thermal interface material assembly after being positioned with the dry material against the mating component to release from the mating component and with the dry material remaining disposed along the thermal interface material.
A method of making a thermal interface material assembly for establishing a thermal-conducting heat path from a heat-generating electronic component within an electronic device to a heat dissipating and/or heat spreading member, the method comprising providing a thermal interface material with a thin dry material along at least a portion of a first side of the thermal interface material such that the dry material has a thickness less than 0.0001 inches, wherein:
- the thermal interface material comprises silicone and is conformable to a mating surface;
- and
- the dry material is less adherent than the thermal interface material and configured to be releasable from the heat-generating electronic component when in contact therewith, thereby allowing the thermal interface material assembly after being positioned with the dry material against the heat-generating electronic component to release from the heat-generating electronic component and with the dry material remaining disposed along the thermal interface material and without the dry material adhering the thermal interface material assembly to the heat-generating electronic component.
A method associated with heat transfer from a heat-generating component within an electronic device, the method comprising installing a thermal interface material assembly between a surface of the heat-generating component and a surface of a heat sink to thereby establish a thermally conducting heat path defined by the heat-generating component, the thermal interface material assembly, and the heat sink for transfer of heat generated by operation of the heat-generating component, the thermal interface material assembly including:
- a thermal interface material comprising silicone and that is conformable to the surface of the heat-generating component and the surface of the heat sink;
- and
- a thin dry material having a thickness less than 0.0001 inches, and disposed along at least a portion of the thermal interface material, wherein the dry material is configured to be releasable from a mating component when in contact therewith, thereby allowing the thermal interface material assembly after being positioned with the dry material against the mating component to release from the mating component and with the dry material remaining disposed along the thermal interface material;
- wherein the dry material is positioned against the surface of the heat-generating component, and wherein the dry material is configured to allow the thermal interface material assembly to release from the surface of the heat-generating component at room temperature without the dry material adhering the thermal interface material assembly to the surface of the heat-generating component.
Dependencies are inferred from the claim text.