Electronic device and method for manufacturing the electronic device

An electronic device comprising:

• a substrate that has a first surface and a second surface opposite to the first surface;
• an electronic component that is mounted on the first surface of the substrate;
• and
• a molding resin that is disposed on the first surface of the substrate and seals the electronic component, wherein
• the substrate has an air vent at a position covered with the molding resin, the air vent passing through the substrate from the first surface to the second surface,
• the second surface of the substrate is covered with a solder resist that has an opening portion at a position corresponding to the air vent, and
• the solder resist surrounds a periphery of the air vent, wherein
• the solder resist has a groove portion that connects to the opening portion.

An electronic device comprising:

• a substrate that has a first surface and a second surface opposite to the first surface;
• an electronic component that is mounted on the first surface of the substrate;
• and
• a molding resin that is disposed on the first surface of the substrate and seals the electronic component, wherein
• the substrate has an air vent at a position covered with the molding resin, the air vent passing through the substrate from the first surface to the second surface,
• the second surface of the substrate is covered with a solder resist that has an opening portion at a position corresponding to the air vent, and
• the solder resist surrounds a periphery of the air vent, wherein
• the second surface of the substrate has a conductor pattern that surrounds the periphery of the air vent with a cutout at a part,
• the solder resist has a covering portion that covers the conductor pattern and a portion corresponding to the cutout of the conductor pattern, and
• the covering portion of the solder resist has a greater height from the second surface of the substrate than the portion corresponding to the cutout of the conductor pattern.