Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards

A method of fabricating a printed circuit board having at least an organic substrate and a copper surface, comprising the steps of:

• cleaning the copper surface with an alkaline and/or peroxide solution;
• stabilizing the copper surface by forming a copper oxide layer on the copper surface by exposing the copper surface to an oxidant and coupling one or more molecules to the copper oxide layer, the one or more molecules comprising a thermally stable base bearing one or more binding groups configured to bind the copper oxide layer and one or more attachment groups configured to attach to the organic substrate;
• terminating formation of the copper oxide by a self-limiting reaction between the copper oxide and the one or more molecules;
• conditioning the stabilized copper surface by reducing the copper oxide layer with a reducing agent;
• and
• bonding the stabilized copper surface with a resin.