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US 9,795,039 B2Granted
Method of making an electronic device having a thin film resistor formed on an LCP solder mask and related devices
AssigneeHarris Corporation
InventorLouis Joseph Rendek, Jr.
Life of this patent
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Abstract
A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.
Claims8
An electronic device comprising:
- a substrate having opposing first and second major surfaces;
- a plurality of circuit layers each comprising a plurality of solder pads carried by a respective one of the first and second major surfaces of said substrate, each of said plurality of solder pads carried by the first major surface being vertically aligned with respective ones of said plurality of solder pads carried by the second major surface;
- a plurality of liquid crystal polymer (LCP) solder masks each carried by a respective one of the first and second major surfaces of said substrate, each LCP solder mask having a plurality of mask openings extending between first and second major surfaces thereof;
- and
- at least one thin film resistor carried by at least one of said plurality of LCP solder masks;
- each LCP solder mask being directly coupled to the substrate without an adhesive layer so that said at least one thin film resistor is directly coupled to said at least one circuit layer and so that said plurality of solder pads is aligned with the plurality of mask openings.
3 more elements
Dependencies are inferred from the claim text.