Mounting structure and method for manufacturing same
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsArata Kishi, Hironori Munakata, Koji Motomura, Hiroki Maruo
Life of this patent
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Abstract
A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.
Claims10
A mounting structure, comprising:
- a semiconductor package having first electrodes;
- a circuit board having second electrodes;
- a bonding material containing solder that is disposed between the second electrode and a bump formed on the first electrode and electrically bonds the bump and the second electrode;
- a first reinforcing resin covering a circumference of the bonding material;
- and
- a second reinforcing resin covering a portion between an outer periphery of the semiconductor package disposed on the circuit board and the circuit board,
- wherein a relationship is established:
- a melting point of the bump>a hardening reaction starting temperature of the second reinforcing resin≧a hardening reaction starting temperature of the first reinforcing resin>a melting point of the bonding material, and
- the first reinforcing resin and the second reinforcing resin do not contact each other.
A mounting structure comprising:
- a semiconductor package having first electrodes;
- a circuit board having second electrodes;
- a bonding material containing solder that is disposed between the second electrode and a bump formed on the first electrode and electrically bonds the bump and the second electrode;
- a first reinforcing resin covering a circumference of the bonding material;
- and
- a second reinforcing resin covering a portion between an outer periphery of the semiconductor package disposed on the circuit board and the circuit board,
- wherein a relationship is established:
- a melting point of the bump>a hardening reaction starting temperature of the second reinforcing resin≧a hardening reaction starting temperature of the first reinforcing resin>a melting point of the bonding material, and
- a difference between a hardening reaction starting temperature of the first reinforcing resin and a hardening reaction starting temperature of the second reinforcing resin is 5° C. to 15° C.
Dependencies are inferred from the claim text.