Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
AssigneePanasonic Corporation
InventorsShingo Yoshioka, Hiroaki Fujiwara
Life of this patent
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Abstract
A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.
Claims5
A three-dimensional structure in which a wiring and a pad part are provided on a surface, wherein at least a part of the surface of the three-dimensional structure comprises an insulating layer containing filler, which comprises fine particles,
- a recessed gutter for the wiring and a hole for the pad part are provided in the surface of the three-dimensional structure, and at least a part of a conductor is embedded in the recessed gutter for the wiring and the hole for the pad part, and
- the filler is exposed on a surface of the recessed gutter such that the surface of the recessed gutter is uneven.
Dependencies are inferred from the claim text.